High-Heat, Lead-Free Soldering in a Shorter Tunnel
Our revolutionary PowerOven-6 can provide low-, medium-, and high-volume manufacturers in a variety of PCB industries a reliable solution to the challenges posed by lead-free reflow soldering, including higher temperatures and a tighter process window resulting in a low margin for error.
They also offer a lower price tag than other options on the market, making them a great choice when factory floorspace and budgetary room are both at a premium. The key to this is a proprietary design that features high-mass heat sources combined with efficient thermal heat transfer capabilities, giving you the uniform heating and exceptional process stability that you’re looking for, even in the face of varying loads.
CBS (center board support) requirement
● Used for wider board which need to support in middle